| 摘要 |
<p>PURPOSE: To enable a semiconductor wafer.polishing process to be lessened in number of processes, easily controlled, to decrease dimples produced on the surface of a wafer in number, and to make a wafer less deformed and improved in flatness by a method wherein a air-permeable and elastic sheet is provided onto the surface of a air-permeable ceramic plate which holds a semiconductor wafer. CONSTITUTION: A sheet 10 which is fibrous or porous, air-permeable, and elastic is pasted on an air-permeable ceramic plate 3 with adhesive agent 9 keeping high in air-permeability. Or a sheet 10 which is fibrous or porous, air-permeable, and elastic is disposed in tension and fixed onto an air-permeable ceramic plate 3 with a jig 12. The sheet 10 is set as thick as 600μm or below. An outer vacuum pump is actuated to generate a suction force for holding a wafer 1 placed on the sheet 10 when the wafer 1 is polished.</p> |
