MANUFACTURE OF CIRCUIT MATERIAL

摘要

PURPOSE: To provide a manufacturing method of a circuit material which constitutes a circuit substrate and can make a large current flow without being limited by a thickness of a conductor economically by using a molding die commonly. CONSTITUTION: The title method is for manufacturing a circuit material constituting a circuit substrate by setting a conductor 11 in a molding die 30 and then injecting resin into the die 30 for making molding resin and the conductor 11 integral. The molding die 30 wherein a plurality of projection parts 31b having the same height are arranged in at least one of surfaces holding the conductor 11 therebetween at an interval which is narrower than a minimum conductor width of the conductor 11 is used.