| 摘要 |
The invention relates to microcircuit packaging techniques, and more particularly to the packaging of a structure compiled of several microcircuits. In an arrangement according to the invention, unpackaged components (2) are mounted on a substrate (20), and to the substrate (20) there is attached a tape (4); on the side of the tape directed away from the substrate, there are formed solder bumps (10). By means of the solder bumps (10), the whole structure can be mounted to a circuit board by applying conventional surface-mounting techniques. The connections between the solder bumps (10) and the I/O lines of the substrate are realised by means of conductive patterns formed on the tape, and by means of leads (14) provided at the edges of the tape. By employing the tape, it is possible to realise various different connections in a versatile manner, for instance connections between the substrate (20) and solder bumps (10), between components (2) and solder bumps (10), between components (2) and the substrate (20) as well as between single components (2). <IMAGE> |
