MOLD FOR PACKAGE MOLDING AND PLASTIC CHARGE-COUPLED DEVICE AND THE MANUFACTURING METHOD USING THE MOLD

摘要

The plastic charge-coupled device is produced in a package by a cavity(22a) formed between a lower mould(21) and an upper mould(22). A protrusion portion(23) with a brim girth(23a) is formed in the cavity(22a) of an upper mould(22) towards the lower mould so as to form a photo-receiving recess on a plastic CCD package. A brim girth(23a) is formed on the protrusion portion(23) so as to closely contact with the top surface of a semiconductor chip(11) and then to prevent the plastic resin from being sunk into the photo-receiving part(11a) on the semiconductor chip. A buffing member may be put between the brim girth of the protrusion portion and the contact surface of the semiconductor so as to diminish the pushing pressure of the mould.