| 摘要 |
PURPOSE: To obtain an epoxy resin compsn. for sealing improved in flowability and in reliability of moisture resistance after soldering and useful for sealng a semiconductor device by compounding an epoxy resin, a curative, and a specific inorg. powdery filler. CONSTITUTION: The compsn. comprises an epoxy resin represented by formula I (R1 to R4 are each H or alkyl; and Gr is a group represented by formula II), a curative, and an inorg. powdery tiller. The filler has an average particle size of 18-25μm and a specific surface area of 2.5-3.5m<2> /g, contains 5-20wt.% particles having particle sizes of 1 pm or lower and a specific surface area of 10-20m<2> /g, and gives. when compression molded by itself under a pressure not affecting the mean particle size, a molding having a vol. fraction of the filler of 78-90%.
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