发明名称 |
High temperature polyether imide compositions and method for making |
摘要 |
Polyetherimide compositions are provided having condensed bis (4-aminophenyl) sulfone units, diaminophenylindane units or a mixture thereof. These polyetherimides compositions have been found useful for making high temperature chip adhesives, laminating adhesives and film adhesives for high density interconnects in electronic circuitry.
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申请公布号 |
US5534602(A) |
申请公布日期 |
1996.07.09 |
申请号 |
US19930047531 |
申请日期 |
1993.04.19 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
LUPINSKI, JOHN H.;COLE, JR., HERBERT S. |
分类号 |
C08G73/10;C08L79/08;H01B3/30;(IPC1-7):C08L77/00 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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