发明名称 |
Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate |
摘要 |
A method of evaluating integrity of adherence of a conductor bond to a substrate includes: a) impinging a plurality of light sources onto a substrate; b) detecting optical reflective signatures emanating from the substrate from the impinged light; c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; d) determining a target site on the selected conductor bond from the detected reflective signatures; e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method.
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申请公布号 |
US5535006(A) |
申请公布日期 |
1996.07.09 |
申请号 |
US19940250078 |
申请日期 |
1994.05.26 |
申请人 |
LOCKHEED IDAHO TECHNOLOGIES COMPANY |
发明人 |
TELSCHOW, KENNETH L.;SIU, BERNARD K. |
分类号 |
G01N21/88;G01N21/956;G01R31/311;(IPC1-7):G01B11/24 |
主分类号 |
G01N21/88 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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