| 摘要 |
PURPOSE: To produce semiconductor chips, with a good yield, to heighten the degree of integration of the semiconductor chips, and to miniaturize the chips by uniformly polishing the surface of wafers. CONSTITUTION: In a wafer polishing device 10, a wafer surface 25A is pressed against an abrasive cloth 27, while a wafer 25 is moved relative to the abrasive cloth 27 in order to polish the wafer surface 25A. In the device 10, a pressing means 12 presses an abrasive pad 24 by means of a fluid-pressure cylinder 18 to give the wafer 25 the pressing force, thereby uniformly pressing the wafer surface 25A against the abrasive cloth 27. Since the rigidity of the pad 24 is increased by pressing the wafer 25 by means of the pressure of liquid, whose volume is invariable, the pressing force of the abrasive pad 24 can be kept constant even when vibration occurs during polishing work. Accordingly, the wafer surface 25A is polished uniformly, thereby enhancing the processing accuracy in every work-stage (such as film-forming, etching stages) in which the semiconductor chips are formed. |
