Semiconductor substrate electrochemical micromachine etching process

摘要

The semiconductor substrate (7) is mounted parallel to the opposite electrode (6) in the electrolysis tank (4) which has a division wall (1) an internal deflection walls (12, 18) that form a circular flow cavity (2) for the electrolyte (17). An impeller (5) circulates the electrolyte (17) past the electrodes (6, 7). An electrical potential is maintained between the electrodes using a three electrode system: substrate (7), opposite electrode (6) and reference electrode (14) controlled by the potentiostat (8). A temperature regulator (10) and sensors (9, 21) control the electrolyte temperature. A Luggin capillary (15) joins the reference electrode tank (19). Seven application examples are given. The method is also suitable for two and four electrode methods. Etching appts. is also claimed.