发明名称 |
Semiconductor device inspection system involving superimposition of image data for detecting flaws in the semiconductor device |
摘要 |
A semiconductor device inspection system having an improved measurement accuracy and in operability. A semiconductor device is observed from the bottom surface side. First, image data obtained upon image pickup under infrared illumination is converted into first left-to-right-reversed image data corresponding to a left-to-right-reversed image and the first reversed image data is stored. Then an image is obtained under no illumination from very weak light emitted from an abnormal portion when a bias is applied to the semiconductor device. Image data of the very weak light image is then converted into second left-to-right-reversed image data corresponding to a left-to-right-reversed image. The first and second left-to-right-reversed image data are superimposedly added to each other and a superimposed image is displayed with the abnormal portion being superimposed on a chip pattern as seen from the top surface of the semiconductor device.
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申请公布号 |
US5532607(A) |
申请公布日期 |
1996.07.02 |
申请号 |
US19940274716 |
申请日期 |
1994.07.18 |
申请人 |
HAMAMATSU PHOTONICS K.K. |
发明人 |
INUZUKA, EIJI;OGURI, SHIGEHISA;SUZUKI, KOUJI;NAGATA, WATARU;HIRUMA, YASUSHI |
分类号 |
G01N21/63;G01N21/88;G01N21/956;H01L21/66;(IPC1-7):G01R31/26 |
主分类号 |
G01N21/63 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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