The method is provided to form the silicide layer which enables the metal layer to be used as sacrificial barrier and diffusion barrier, comprises the steps of: forming a layer (40) which contains metal to be silicide on top of an internal silicon layer (3) which contains silicon; forming a metallic silicide layer (6) by thermal process wherein the layer (6) is of titanium silicide layer.
申请公布号
KR960008567(B1)
申请公布日期
1996.06.28
申请号
KR19930011752
申请日期
1993.06.25
申请人
HYUNDAI ELECTRONICS IND. CO., LTD.
发明人
JANG, HYUN - JIN;YEU, TAE - JUNG;CHON, YOUNG - HO;KO, JAE - WAN;KOO, YOUNG - MO