发明名称 SILICIDE LAYER FORMING METHOD
摘要 The method is provided to form the silicide layer which enables the metal layer to be used as sacrificial barrier and diffusion barrier, comprises the steps of: forming a layer (40) which contains metal to be silicide on top of an internal silicon layer (3) which contains silicon; forming a metallic silicide layer (6) by thermal process wherein the layer (6) is of titanium silicide layer.
申请公布号 KR960008567(B1) 申请公布日期 1996.06.28
申请号 KR19930011752 申请日期 1993.06.25
申请人 HYUNDAI ELECTRONICS IND. CO., LTD. 发明人 JANG, HYUN - JIN;YEU, TAE - JUNG;CHON, YOUNG - HO;KO, JAE - WAN;KOO, YOUNG - MO
分类号 H01L21/28;(IPC1-7):H01L21/28 主分类号 H01L21/28
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