发明名称 GOLD STRIPPING COMPOSITION AND USING METHOD THEREOF
摘要 The invention relates to a gold stripping composition and a using method thereof. The gold stripping composition provided by the invention is formed by stripping gold from a base material; the composition comprises one or more gold stripping compounds and a conduction assisting compound, wherein the gold stripping compounds can from covalent bonding with gold, thus the gold on the base material is stripped off; and through the effects of the conduction assisting compound, voltage can be lowered and the gold stripping can be completed without causing damage to the base material, wherein the composition does not contain any cyanide. The invention also provides a using method of the gold stripping composition. According to the conventional gold stripping method, relative risk is caused to operating personnel, and the waste liquid during the process is troublesome to treat, additionally the base material can be damaged, and both the gold stripping speed and gold dissolving quantity have room for improvement. In view of the issue, the invention tries to provide a gold stripping technology without cyanide, not only can the gold be recovered effectively, multiple problems encountered by the prior art can be prevented.
申请公布号 HK1178222(A1) 申请公布日期 2016.08.26
申请号 HK20130105951 申请日期 2013.05.21
申请人 Uwin Nanotech. Co. Ltd. 发明人 Ching-Hsiang HSU
分类号 C25F 主分类号 C25F
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