发明名称 Stamp assembly and stamp unit including the stamp assembly and a perforation device
摘要 <p>A guide hole 18 is formed in a left side wall 17 of a grip 2 provided to a stamp assembly 1. When the stamp assembly 1 is mounted to a thermal perforation unit 50, a guide bar 38 provided to the thermal perforation unit 50 is inserted into the guide hole 18. A protector clasp 18a for opening and closing the guide hole 18 is provided to the left side wall 17. The protector clasp 18a can be manually slid up and down in a protector clasp groove 17a. When the protector clasp 18a is in a lower position shown in Fig. 1 (a), the guide hole 18 is closed so that the stamp assembly 1 can not be mounted to the thermal perforation unit 50. When the protector clasp 18a is in an upper position shown in Fig. 1 (b), the guide hole 18 is closed so that the stamp assembly 1 can be mounted to the thermal perforation unit 50. &lt;IMAGE&gt;</p>
申请公布号 EP0718111(A1) 申请公布日期 1996.06.26
申请号 EP19950309038 申请日期 1995.12.12
申请人 BROTHER KOGYO KABUSHIKI KAISHA 发明人 SEO, KEIJI
分类号 B41C1/055;B41K1/32;B41L13/02;(IPC1-7):B41K1/32 主分类号 B41C1/055
代理机构 代理人
主权项
地址