| 摘要 |
A spincup having a wafer backside deposition reduction apparatus is used to reduce wafer backside particle deposition of materials on a wafer during processing. The spincup includes an opening for accommodating a wafer supporting chuck and a particle guard which circumscribes the chuck. The particle guard contacts the base of the spincup and circumscribes the chuck. When the chuck supports a wafer, a wafer backside region is defined between the chuck and the particle guard. The spincup further includes an exhaust channel coupled to the wafer backside region to independently exhaust the wafer backside region. In one embodiment, the exhaust channel includes an exhaust port for connecting a vacuum generator to the exhaust channel and a shroud contacting a base of the spincup and the particle guard. In another embodiment, the exhaust channel includes exhaust tubes which replace the exhaust manifold shroud and exhaust port.
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