CIRCUIT PACK COOLING USING TURBULATORS

摘要

Disclosed is a fluid-cooled circuit pack which includes heat generating components on a front surface of a circuit board and another surface opposite to the front surface to create a channel for the flow of cooling fluid over the components. An array of rods, or turbulators, is provided on the surface opposite the printed circuit board front surface to create disturbances in the fluid flow and enhance heat transfer.