| 摘要 |
<p>PURPOSE: To provide a ceramic wiring basic material suppressing discontinuity in a connection part due to a ceramic destruction due to a thermal hysteresis even in the case where a difference in thermal expansion between a package made of ceramic or a wiring board, etc., and a mother board of a printed wiring board, etc., is large. CONSTITUTION: This embodiment is a ceramic wiring basic material of a BGA package 1, etc., comprising: a first ceramic GM wiring board 2 forming a wiring layer or the surface and at least one of the inside; and a second ceramic wiring board 3 that a mechanical strength is larger than the first ceramic wiring board 2, an internal wiring layer electrically connected with the wiring layer of the first ceramic wiring board 2 is provided, and that is connected to the first ceramic wiring board 2. A mother board of a printed wiring board 10, etc., is connected to a connecting terminal such as a solder bump 8 provided in the second ceramic wiring board 3.</p> |
