| 摘要 |
An insole assembly comprises an insole having a pad of microcellular resilient material on at least one surface thereof. The pad is formed by a hot-forming process, and is heated-bonded to the insole by heat produced during that process. In an alternative embodiment, the pad has two parts which are disposed respectively on opposite sides of the insole, and the insole has an aperture through which these parts are integrally connected with one another. The parts of the pad overlap an edge of the aperture, so that an area of the insole adjacent to that edge is sandwiched between those parts.
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