| 摘要 |
<p>PURPOSE: To prevent a short circuit by conductive particles from occurring and to flatening an interlayer insulating film covering a wiring layer, etc., by suppressing a pattern jumping or a narrow pattern forming at the time of transferring a dummy pattern in a method for forming a pattern including a dummy pattern forming process. CONSTITUTION: The dummy pattern 22 separated from a main pattern 21 at least by a space W is formed, the dummy pattern 22 is partially removed by a removing pattern 23, the dummy pattern group 22d-22h divided and separated from each other are formed. Small dummy patterns 22f, 22h which are below minimum allowable width (a) or below minimum allowable area S among dummy pattern group 22d-22h and the dummy pattern 22d adjacent to the small dummy patterns 22f, 22h are connected by a connection dummy pattern 22i or small dummy patterns 22e, 22g are removed.</p> |
