| 摘要 |
<p>PURPOSE:To prevent a soldered electrode from being exfoliated from a semiconductor substrate by a method wherein titanium is formed on the surface of the semiconductor substrate, silver is then formed and a soldered layer is formed on a metal layer composed of the silver so that good ohmic contact can be maintained. CONSTITUTION:A Ti layer 2 is formed by evaporation on the surface of a semiconductor substrate 1; an Ag layer 3 is then formed by evaporation. This assembly is sintered at 400 deg.C for 30 min so that ohmic contact can be maintained between the silicon semiconductor substrate 1 and the Ti layer 2. Then, an Sn layer 4 is formed by evaporation; the layers 2-4 are then patterned. After that, a laser diode chip 5 is soldered to the semiconductor substrate 1 through the Sn layer 4 by means of a P-side electrode 6 composed of Ti, Ni and Au. Through this constitution, it is possible to prevent a soldered electrode from being exfoliated from the semiconductor substrate while good ohmic contact is maintained.</p> |
