| 摘要 |
<p>A cooling device of a multi-chip module which comprises micropackages (2) independent of thermal deformation and easy to assembly and disassembly and which has an excellent cooling efficiency. The multi-chip module comprises a multi-layer substrate (4) on which the micropackages (2), each encasing an LSI chip (1), are mounted, and a housing (11) formed integrally with cooler (12). Each of the micropackages (2) comprises a first heat conduction member (6), having a cap portion (6b) for receiving the LSI chip (1) and a first fin (6a) and made of the same material as the cap portion (6b) to be integral therewith, and a substrate fixed to the cap portion (6b) of the first heat conduction member (6), the LSI chip (1) being mounted on the substrate securely fixed to the cap portion (6b) of the first heat conduction member (6) while being fixedly joined at the back surface thereof to an inner surface of the cap portion (6b) of the first heat conduction member (6). Second heat conduction members (7), each comprising a base portion and a second fin (7a), are so disposed as to engage with the first fins (6a) and pressed against the cooler (12) by a spring (9), respectively. <IMAGE></p> |
