发明名称 |
Wafer method for breaking a semiconductor |
摘要 |
A process for partially sawing the streets on semiconductor wafers. After sawing the streets can be covered by a protective material, and then the wafer continues its processing as before. After the wafer is broken, the protective material may or may not be removed. Additionally, the wafer may be broken into individual chips using a wedge piece that has a number of individual wedges on it, where the individual wedges press against the partially sawn streets, causing the wafer to break.
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申请公布号 |
US5527744(A) |
申请公布日期 |
1996.06.18 |
申请号 |
US19940342988 |
申请日期 |
1994.11.21 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
MIGNARDI, MICHAEL A.;ALFARO, RAFAEL C. |
分类号 |
B28D5/00;B81C1/00;B81C99/00;H01L21/301;H01L21/304;H01L21/78;(IPC1-7):H01L21/301 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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