| 摘要 |
PURPOSE: To polish semiconductor wafers to uniform thickness by maintaining a wafer chuck table and a turntable parallelly. CONSTITUTION: First magnetism generating bodies 8 are provided in a wafer chuck table 4, and second magnetism generating bodies 9 for generating magnetism repulsive to magnetism generated by the first magnetism generating bodies 8 are provided in a turntable 7. Parallelism between the lower face of the wafer chuck table 4 and the upper face of the turntable 7 is maintained by repulsive force generated by the magnetism generated by the first magnetism generating bodies 8 and the magnetism generated by the second magnetism generating bodies 9 so as to polish semiconductor wafers to uniform film thickness. |
