| 摘要 |
Disclosed are an apparatus and method for coupling a heat sink to a heat-producing electronic component, such as a microprocessor, into an assembly. The apparatus comprises: (1) a resilient clip member having a central, substantially arcuate portion of a selected radius of curvature, the arcuate portion thereby having a concave surface and a convex surface, the clip member further having an opposing pair of end portions bent with respect to the arcuate portion toward the concave surface, the end portions substantially parallel to one another, the end portions further including inwardly-facing projections for engaging with a lower surface of the component and (2) a fulcrum member coupled to a selected point on the concave surface of the clip member, the fulcrum member urging against an upper surface of the heat sink when pressure is applied to the convex surface of the arcuate portion, the arcuate portion flattening, the end members rotating outwardly with respect to one another to thereby disengage the inwardly-facing projections from the lower surface, the apparatus thereby free to be removed from the assembly. The arcuate portion cooperates with the fulcrum member to allow removal of the apparatus without requiring use of a tool.
|
