| 发明名称 |
Process for coated bonding wires in high lead count packages |
| 摘要 |
A transfer molded high lead count plastic semiconductor package is described. The packaged IC chip is mounted upon a suitable leadframe and the bonding pads wire bonded to the leadframe fingers. To avoid wire shorting, due to wire sweep during transfer molding, the wires are first coated with an insulative material.
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| 申请公布号 |
US5527742(A) |
申请公布日期 |
1996.06.18 |
| 申请号 |
US19950495388 |
申请日期 |
1995.06.28 |
| 申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
WEILER, PETER M.;BURKE, THOMAS S. |
| 分类号 |
H01L23/29;H01L21/56;H01L21/60;H01L23/31;H01L23/49;(IPC1-7):H01L21/60 |
主分类号 |
H01L23/29 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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