发明名称
摘要 PURPOSE:To prepare the title compsn. which gives a molding excellent in heat resistance, light resistance, and physical characteristics without corroding a metal mold at a normal molding temp. by a thermoplastic resin molding method such as injection molding, extrusion or calendering. CONSTITUTION:The title compsn. is prepd. by compounding 100 pts.wt. thermoplastic resin, 2-48 pts. wt. 2, 4, 6-tris (2, 4, 6-tribromophenoxy)-1, 3, 5-triazine having an m.p. of 225-235 deg.C, 5-50 pts.wt. brominated epoxy polymer having a mol.wt. of 1000-50000, and 1-20 pts.wt. antimony trioxide.
申请公布号 JP2506278(B2) 申请公布日期 1996.06.12
申请号 JP19910125379 申请日期 1991.04.25
申请人 DAI ICHI KOGYO SEIYAKU CO LTD 发明人 NISHIBORI SETSUO;NABESHIMA TOSHIICHI;KONDO HIDETO
分类号 C08K3/22;C08K5/3477;C08K5/3492;C08L101/00;(IPC1-7):C08L101/00;C08K5/349 主分类号 C08K3/22
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