SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE: To provide a high connection reliable LSI package in the case of packaging on a printed-wiring board at low heat resistance fit for multiple pins, high density packaging at low cost. CONSTITUTION: Within the semiconductor integrated circuit device as an LSI package, a TAB tape 6 formed of outer electrode pads 9 comprising a wiring pattern and a part of lead wiring 8 is arranged so that the outer electrodes parts 9 may be positioned on the rear surface side of a substrate 1 while the periphery of the TAB tape 6 may be bent on the main surface side of the substrate 1 so as to electrically connect a semiconductor chip 2 mounted on the main surface of the substrate 1 to one end of the lead wiring 8 provided on the main surface side of the substrate 1.