| 摘要 |
<p>A resin material (2) with excellent heat resistance and excellent adhesion to a lead frame (1) for insertion in an electronic component comprises: (A) 100 parts by weight of a polyarylene sulphide resin, (B) 0.1 to 30 parts by weight of an alpha -olefin copolymer graft-copolymerized with an unsaturated carboxylic acid or its anhydride, and (C) 10 to 300 parts by weight of a fibrous filler, a nonfibrous inorganic filler or a mixture thereof. e</p> |
