| 摘要 |
PURPOSE: To improve wettability and adhesiveness so as to endure use in a high vacuum condition by connecting by soldering a target member and a cooling member formed with a film of Ti, Pt, Au and Ge. CONSTITUTION: A film of Ti, Pt, Au and Ge having a 0.05 to 1.00μm thickness is successively applied to a connection-difficult target member 1 and cooling member 2. Next in connection surfaces of this target member 1 and cooling member 2, a solder foil 3 is arranged and heated to connect the members to each other.
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