| 摘要 |
PURPOSE: To make it possible to eliminate perfectly such a possibility that chips in bulk cassettes are rubbed and collided with each other, made dirty and damaged to reduce their electrical performance. CONSTITUTION: A chip mounting device consists of printed boards A, which are transferred by a belt conveyor for mounting chips (t) per one piece on an installing position and are set at a home position, a feeder B, which is provided with a multitude of feeding paths 1 for feeding forward the chips (t) in a state that the chips (t) are aligned in one column in parallel with each other, and a group C of bulk cassettes, in which a multitude of the chips (t) are housed in cassettes 2a in a bulk state and a multitude of the bulk cassettes 2 provided so as to align and stagnate the chips (t) on one column on alignment paths 2b on the lower ends of the cassettes 2c are provided in parallel with each other. The feeder B is constituted into a structure, wherein the feeder B is provided so as to be able to freely move left and right centering around a pickup point P of the chips (t) and at the same time, the feeder B is provided in such a way as to be able to freely move in the forward and backward directions so that each feeding part 1 of the feeder B docks with each alignment path 2b of the group C of the bulk cassettes. |
