发明名称 COMPONENT MOUNTING DEVICE
摘要 PURPOSE: To shorten each component mounting time by a component mounting device and to improve the mounting efficiency of the device. CONSTITUTION: An electronic component 4 fed from a component feeding part is sucked by a suction nozzle 6 and the position of the sucked component 4 is measured by a recognition camera 21. As the camera 21 is arranged in such a way that its image optical axis L5 is offset from the axial line L3 of the nozzle 6 by a prescribe amount, there is not need to move the camera 21 when the camera images the component. Accordingly, a process for moving the component sucked for imaging and for a position recognition in the direction of the camera or for moving the camera in the direction of the component is eliminated and it becomes possible to reduce a component mounting time.
申请公布号 JPH08148897(A) 申请公布日期 1996.06.07
申请号 JP19940283894 申请日期 1994.11.18
申请人 JUKI CORP 发明人 OZAWA MASATO
分类号 B23P19/00;H05K13/04;H05K13/08 主分类号 B23P19/00
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