| 摘要 |
PURPOSE: To easily prevent generation of unsoldered parts. CONSTITUTION: A heat insulating film 10 is arranged in contact with the solder sticking side of an FPC 2 in the manner in which lands 3 and terminals 4 are positioned in through holes 11 of the heat insulating film 10. A heat insulating board 13 is arranged to abut against the opposite side of the FPC 2 side of the heat insulating film 10 in the manner in which the lands 3 and the terminals 4 are positioned in the part of an aperture 14 of the heat insulating board 13, and the heat insulating film 10 is arranged between the FPC 2 and the heat insulating board 13. Thereby, an overall soldering method is enabled without deteriorating heat insulating effect, when the heat insulating board 13 is thin. Molten solder 6 passes through the aperture 14 and the through holes 11 and easily reaches the lands 3, and generation of unsoldered parts can be prevented. |
