| 摘要 |
PURPOSE: To prevent moisture from entering through an adhesion boundary by covering the adhesion area between a case and cured resin, such as epoxy resin, exposed outside a device, with a resin having a modulus of elasticity within a specific range. CONSTITUTION: Silicone gel 8 is injected into the case of a semiconductor device through the gap between the lid 6 and enclosing portion 7 of the case, and placed on its base 2. The silicone gel is then heated and cured. Anhydridesetting alicyclic epoxy resin 9 is injected and placed on the cured gel 8. It is then heated and cured. Then a liquid sealing resin 10 with a modulus of elasticity of 0.1-1000kgf/cm<2> is injected and placed on the cured epoxy resin 9. It is then cured. This makes it possible to prevent the entry of moisture through the boundary between a case and cured resin, which may be a major cause of the degradation in the moisture resistance of semiconductor devices. Therefore, a resin-sealed semiconductor device, excellent in moisture resistance, is obtained without sacrificing the processability of conventional semiconductor devices. |
