| 摘要 |
PURPOSE: To provide a production method of a semiconductor device by which after a resist is removed by using an org. alkali compd., corrosion or cutting of metal wiring layers or thinning of lines in a rinsing process can be prevented, and thereby, which is effective to improve reliability and production yield. CONSTITUTION: The production method of a semiconductor device includes a process to remove a photoresist film with a peeling liquid containing an org. alkali compd., and a process to rinse with a rinsing liquid containing a proton-accepting solvent having a low dielectric const. |
