| 发明名称 |
METHOD, FLIP-CHIP MODULE, AND COMMUNICATOR FOR PROVIDING THREE-DIMENSIONAL PACKAGE |
| 摘要 |
<p>A method (100), stacked module (200, 300 and 400), and communicator (500 and 600) are provided for packaging flip-chip bonded integrated circuits. A first integrated circuit is flip-chip bonded to a surface of a mounting unit. A second integrated circuit is mounted on the first integrated circuit using an adhesive and is wire bonded to the surface of the mounting unit.</p> |
| 申请公布号 |
WO9617505(A1) |
申请公布日期 |
1996.06.06 |
| 申请号 |
WO1995US12130 |
申请日期 |
1995.09.25 |
| 申请人 |
MOTOROLA INC. |
发明人 |
THOMAS, MICHAEL, EDWARD;TOMASZEWSKI, JAMES, OSCAR;GOODMAN, CATHRYN, ELIZABETH |
| 分类号 |
H01L21/60;H01L25/18;H05K7/02;(IPC1-7):H05K7/02;H05K3/34;H01R23/50 |
主分类号 |
H01L21/60 |
| 代理机构 |
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