Mirror polishing device for semiconductor wafers

摘要

The polishing device has a rotary drum (3) with a polishing cloth (16) applied to its outer surface, pressed into contact with the surface of the semiconductor wafer (9). A polishing soln. containing fine abrasive particles is applied to the cloth during polishing.The drum or the seating (8) supporting the semiconductor wafer is displaced in a direction perpendicular to the drum axis and a direction parallel to the polished surface, so that the polishing is effected over the full surface of the semiconductor wafer.