发明名称 |
Cap to close off open via holes in PCBs |
摘要 |
<p>A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material with a plane of at least one electrically insulating material on both sides of the at least one plane of at least one electrically conducting material. The at least one core includes a plurality of plated through holes formed therethrough. At least one pad is provided over at least one of the plated through holes. The pad provides a flat surface for attaching an electronic device and also prevents solder from entering the at least one plated through hole. <IMAGE></p> |
申请公布号 |
EP0715355(A2) |
申请公布日期 |
1996.06.05 |
申请号 |
EP19950117631 |
申请日期 |
1995.11.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KAMPERMAN, JAMES S.;GALL, THOMAS P.;STONE, DAVID B. |
分类号 |
H01L21/48;H01L23/498;H01L23/538;H05K1/11;H05K3/00;H05K3/06;H05K3/20;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):H01L23/538;H01L21/60 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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