发明名称 METHOD FOR MOLDING RAISING SEEDLING DEVICE
摘要 <p>PURPOSE: To provide a method for molding a raising seedling device designed to efficiently produce uniform raising seedling devices intended to reduce their cost by preventing developing molding defects and/or casting fins to the utmost. CONSTITUTION: In the method for molding a raising seedling device made of a synthetic resin in such fashion that the opening 2a... sides of many pots 2... communicate with one another, the bottom 2b... sides are independent of one another, and these bottoms 2b have holes 2d... respectively, an injection molding is conducted by using a mold to make a raising seedling device with no holes 2d... at the bottoms 2b... of the pots 2..., and these bottoms 2b... are punched with the holes 2d....</p>
申请公布号 JPH08140485(A) 申请公布日期 1996.06.04
申请号 JP19940280857 申请日期 1994.11.15
申请人 ISEKI & CO LTD 发明人 ISHIDA ISAO;SAEKI MASABUMI
分类号 A01G9/02;B29C69/00;B29D99/00;B31B27/02;B65D1/00;B65D1/09;(IPC1-7):A01G9/02;B29D31/00 主分类号 A01G9/02
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