发明名称 |
Treatment of electroless plating waste streams |
摘要 |
A method for treating the waste stream resulting from electroless plating operations such as copper electroless plating. The waste stream is simultaneously treated with hydrogen peroxide and UV light to bring the level of contaminants below the discharge limit. In one embodiment, the waste stream is also diluted with rinse water from the plating process.
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申请公布号 |
US5523001(A) |
申请公布日期 |
1996.06.04 |
申请号 |
US19940367403 |
申请日期 |
1994.12.30 |
申请人 |
AT&T CORP. |
发明人 |
FOECKLER, JR., EUGENE P.;LAL, SUDARSHAN |
分类号 |
C02F1/32;C02F1/58;C02F1/62;C02F1/72;C02F9/00;C23C18/16;(IPC1-7):C02F1/32 |
主分类号 |
C02F1/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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