| 摘要 |
PURPOSE: To provide an optical semiconductor device which facilitates high density wiring and mounting and, further, facilitates miniaturization of the device. CONSTITUTION: A slit 6 is so formed in a board 1 in an optical semiconductor device 21 as to have its aperture area gradually increased from one surface 1a side to the other surface 1a side of the board 1. The light emitting part of an LED chip 3 is mad to face the slit 6. The bumps 10a and 10b of the LED chip 3 are electrically connected to wiring patterns 15 and 16 with a conductive paste 11 and the LED chip 3 is driven by respective IC chips 4 and 7. A light emitted from the light emitting part of the LED chip 3 is emitted in the direction 18 of emission through the slit 6. |
