发明名称 CERAMIC CIRCUIT BOARD AND ITS MANUFACTURE
摘要 <p>PURPOSE: To eliminate a step between a ceramic substrate and a glaze film and prevent discontinuity of a connecting pattern to be formed on the step part by simultaneously forming by firing the glaze film in the recessed part, which is formed on the surface of the ceramic substrate, with the ceramic substrate. CONSTITUTION: A recessed part 2 is provided on the surface of a ceramic substrate 2, and a glaze film 3 is formed in the recessed part 2. The ceramic substrate 1 and the glaze film 3 are formed of materials that sinter at 1000 deg.C or below, are formed by simultaneous baking, and at the boundary, a glass diffusion layer 4, in which the glass component of the glaze film 3 is diffused, is formed. Thus, strength of the glaze film 3 and the ceramic substrate 1 is improved, and cracks are eliminated. A step between the surfaces of the glaze film 3 and the ceramic substrate 1 is eliminated, or the step between the surfaces becomes 20μm or less in height, and discontinuity of a connecting pattern to be formed on the step part is prevented.</p>
申请公布号 JPH08139230(A) 申请公布日期 1996.05.31
申请号 JP19940303069 申请日期 1994.11.11
申请人 SUMITOMO KINZOKU CERAMICS:KK 发明人 ARAKI HIDEAKI;FUKUDA JUNZO;FUKAYA MASASHI
分类号 C03C17/02;G01R33/09;G11B5/31;G11B5/39;H01F10/26;H01F41/16;H01L21/48;H01L23/12;H01L23/13;H01L43/06;H05K1/03;H05K3/12;(IPC1-7):H01L23/13 主分类号 C03C17/02
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