| 摘要 |
PURPOSE: To obtain a method for inspecting the wire bondability of a conductor circuit quickly. CONSTITUTION: Prior to wire bonding of a conductor circuit 1 and an electronic device, the surface of the conductor circuit 1 is subjected to quantitative analysis of element. When the conductor circuit 1 comprises an underlying layer 4 of copper, an intermediate layer 6 of palladium, and a surface layer 7 of gold, wire bondability of the conductor circuit 1 is decided based on the atomic concentration of copper component on the surface. When the conductor circuit 1 comprises an underlying layer of copper, a lower intermediate layer of nickel, an upper intermediate layer of palladium, and a surface layer of gold, wire bondability of the conductor circuit is decided based on the total atomic concentration of copper component on the surface and nickel component. |
