| 摘要 |
PURPOSE: To provide the title manufacturing method of printed-wiring board having excellent bond properties between inner layer copper foils, outer layer copper foils and an electroplating copper while avoiding a decline in precipitation of manganese oxide on an insulator surface on a through hole inner wall, especially on a glass cloth, thereby improving the conductivity on the through hole inner wall part. CONSTITUTION: The title manufacturing method of pronted-wiring board is composed of the four steps as follows, i.e., the first step of treating a perforated and cleaned printed-wiring board with a solution containing neutral permanganate, the second step of pickling the printed-wiring board, the third step of coating the printed-wiring board inner wall part with organic monomer and the fourth step of immersing the printed-wiring board in an acid solution for making an organic monomer into conductive polymer. |
