| 摘要 |
<p>PURPOSE: To improve heat dissipating quality of the whole of a semiconductor device, by providing a thermal conductor opposed to a semiconductor element on the side of its board whereon the semiconductor element is mounted, and by dissipating the heat from the semiconductor element not only through the opposite side of the board to the semiconductor-element mounting surface but also through the side of the semiconductor-element mounting surface. CONSTITUTION: On the surface side of a board 3 whereon a semiconductor element 1 is mounted, a cap 9 made of a material having a good thermal conduction quality is so mounted that the whole of the top and side surfaces of the semiconductor element 1 is covered therewith. Also, the surface side of the board 3 whereon the semiconductor element 1 is mounted is so sealed with a resin material 6 that the whole of the cap 9 is covered therewith. Therefore, the heat generated from the semiconductor element 1 is dissipated not only through via holes 7 and solder balls 8, but also via the cap 9, through the whole surface of the side of a package whereon the semiconductor element 1 is mounted. Thereby, the heat dissipating effect of a semiconductor device can be improved largely.</p> |
