| 发明名称 |
Semiconductor package that includes stacked semiconductor die |
| 摘要 |
A semiconductor package that includes at least two semiconductor devices that are coupled to one another through a conductive clip.
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| 申请公布号 |
US7615854(B2) |
申请公布日期 |
2009.11.10 |
| 申请号 |
US20060592407 |
申请日期 |
2006.11.03 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
MONTGOMERY ROBERT |
| 分类号 |
H01L23/31;H01L23/28;H01L23/48 |
主分类号 |
H01L23/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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