| 摘要 |
PURPOSE: To provide a semiconductor device which has excellent heat dissipation and allows stable electrical operation by manufacturing the semiconductor device by simple processes. CONSTITUTION: A protruding electrode 12 provided on a semiconductor chip 1 is arranged so as to electrically connect with the wiring board electrode 14 of a wiring board 13 provided with inner wiring 13a. A heat dissipation plate 16 is permitted to make contact with the rear surface of the semiconductor chip 1 and is integrally formed with the wiring board 13 so as to seal the semiconductor chip. The heat dissipation plate 16 is provided with a recessed part with a tapered cross-section, the semiconductor chip 1 is arranged between the recessed part and the wiring board 13, and the rear surface of the semiconductor chip 1 is firmly fixed on the inner wall of the recessed surface. Therefore, the semiconductor device with excellent heat dissipation and stable electrical characteristics is provided by simple manufacturing process. |
