摘要 |
The invention relates to the production of a pressure glass passing-through in a metal body. Such pressure glass passing-throughs are used in metal housings for semiconductors, in particular integrated circuits. These passing-throughs must hermetically seal the interior of the housing from the exterior. For this purpose, a glass bead is fused into a bore of the housing and the connecting lead of the integrated circuit is passed through the glass to the outside. It has now been found that alloys of the Cu, Al, Mg systems show, during cooling after the fusion step, a hardening effect with the result that, with these alloys, pressure glass passing-throughs can be produced which show hermetic sealing even after high thermal and/or mechanical stress. They have a high thermal shock resistance and good corrosion resistance. <IMAGE> |
申请人 |
DIEHL GMBH & CO, 90478 NUERNBERG, DE;ELECTROVAC, FABRIKATION ELEKTROTECHNISCHER SPEZIALARTIKEL GESELLSCHAFT M.B.H., WIEN, AT |
发明人 |
HORNIG, WOLFGANG, DR., 8505 ECKENHAID, DE;FINDL, WALTER, DIPL.-ING., WIEN, AT |