| 摘要 |
PURPOSE: To obtain an epoxy resin composition for tape automated bonding(TAB) sealing, excellent in low stress properties and capable of providing a cured product excellent in filling properties in a narrow gap and suitable as a transfer moldable resin for the TAB sealing. CONSTITUTION: This epoxy resin composition for TAB sealing is obtained by using a resin component having <=14cSt viscosity at 25 deg.C of a 40wt.% solution in methyl isobutyl ketone as the resin component comprising an epoxy resin and a curing agent and blending fused silica having a particle size distribution of <=0.2wt.% particles having >=24μm particle diameter, 20-80wt.% particles having >=3μm particle diameter and 20-80wt.% particles having <3μm, and an average particle diameter of <=10μm as an inorganic filler in an amount of 65-90wt.% based on the whole composition therewith in the epoxy resin composition for the TAB sealing containing the epoxy resin, curing agent and inorganic filler.
|
