发明名称 Headphone assembly
摘要 A headphone assembly adapted for engaging a user's head includes an adjustable headband having first and second ends. A right ear piece is attached to a first end, and a left ear piece is attached to a second end of the headband. Each ear piece is substantially semi-circular shaped, and has a substantially inverted U-shaped shell having an inverted U-shaped inner wall. The U-shaped inner wall defines an acoustic cavity having a bottom end opening for receiving approximately the top half of the user's ear. A rear wall of the acoustic cavity has a number of holes extending therethrough behind which a speaker is mounted. An inverted U-shaped chamber is provided about the acoustic cavity. The right ear piece chamber will hold the electronic circuitry necessary for a cordless receiver. The left ear piece has a similar chamber which accepts a power board. A dome-shaped cover plate covers each of the speaker elements and the respective power board and circuit board, with the user's ear only partially enclosed by the ear piece. Alternatively, a planar cover plate covers each of the speaker elements and the respective circuit board, and a lower ear piece is pivotally attached to the upper ear piece for movement between an open position and a closed position. The lower ear piece also includes an acoustic cavity and has an open upper end for communicating with the bottom end opening of the U-shaped inner wall.
申请公布号 US5519783(A) 申请公布日期 1996.05.21
申请号 US19940319454 申请日期 1994.10.06
申请人 KHYBER TECHNOLOGIES CORPORATION 发明人 KUMAR, RAJENDRA
分类号 H04R1/10;H04R5/033;(IPC1-7):H04R25/00 主分类号 H04R1/10
代理机构 代理人
主权项
地址