| 发明名称 |
Method of arranging components in semiconductor device |
| 摘要 |
A method of arranging components in a semiconductor device on a substrate (11), comprising provisionally determining a wiring path (3) so that a predetermined wiring capacitance is not exceeded in a specific network (1) and then performing a wiring process of elements (12) in the specific network within a component placement region (2) determined by the wiring path.
|
| 申请公布号 |
US5519631(A) |
申请公布日期 |
1996.05.21 |
| 申请号 |
US19950469375 |
申请日期 |
1995.06.06 |
| 申请人 |
FUJITSU LIMITED;FUJITSU VLSI LIMITED |
发明人 |
NISHIOKA, SEISHI;OKADA, ATSUHIKO |
| 分类号 |
H01L21/822;G06F17/50;H01L21/82;H01L27/02;H01L27/04;H01L27/118;(IPC1-7):G06F17/50 |
主分类号 |
H01L21/822 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
