| 摘要 |
PURPOSE: To prevent a package from warping by bonding a semiconductor chip to a die pad and then injecting a sealing resin while pressing the semiconductor chip with the resiliency of the support bar of the die pad through an upper die. CONSTITUTION: An adhesive tape is applied to a die pad and a semiconductor chip 1 is thermocompressed thereto before inner leads are wire bonded to outer terminals. The semiconductor chip 1 is then mounted, on the side opposite to the circuit forming side, on a protrusion 11 of a lower die 10b. Subsequently, the support bar 9 of the die pad is pressed through the upper die 10a to retain the semiconductor chip 1 by the resiliency of the support bar 9 thus suppressing displacement of the semiconductor chip 1. Finally, a sealing resin is injected into the space formed between the upper and lower dies 10a, 10b. Since the thickness of sealing resin is equalized at the upper and lower parts the semiconductor chip 1, the package can be protected against warping. |
